Part A
10M16SAU169I7G
訊息
- Lifecycle
- Active
- Stock
- 6216 件
- Package
- BGA-169
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16SAU169I7G is a viable functional replacement candidate for the 10M16DCF484C8G only when the application can accommodate a different package footprint, a different speed grade, and an extended industrial temperature range. Both devices share the same Intel MAX 10 FPGA family, 16,000 logic elements, and non-volatile instant-on configuration architecture, but the 10M16DCF484C8G is supplied in a 484-ball FineLine BGA package with commercial temperature support and a faster speed grade, while the 10M16SAU169I7G is supplied in a 169-ball Ultra FineLine BGA package with industrial temperature support and a slower speed grade. Designers must validate pinout, I/O count, thermal performance, and timing closure before committing to a cross-reference.
Package Type
Validation required
Speed Grade
Validation required
Operating Temperature
Validation required
Logic Element Count
High match
Parts at a glance
Part B
10M16DCF484C8G
訊息
- Lifecycle
- Active
- Stock
- 6504 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DCF484C8G | 10M16SAU169I7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both belong to the same MAX 10 FPGA family, which is essential for functional substitutability and toolchain compatibility. |
| Logic Elements (LEs) | 16,000 | 16,000 | Identical logic density ensures equivalent programmable logic capacity for the target design. |
| Package / Pin Count | 484-pin FBGA | 169-pin UBGA | Different packages and pin counts affect PCB footprint, routing, and available I/O, directly impacting board-level interchangeability. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Temperature grade determines suitability for commercial versus industrial environments and affects reliability under extreme conditions. |
| Speed Grade | 8 (Fastest) | 7 (Fast) | Speed grade influences maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Embedded Memory (M9K Blocks) | 549 Kbits | 549 Kbits | Identical embedded memory capacity supports the same on-chip data buffering and storage requirements. |
| User Flash Memory (UFM) | Yes | Yes | Both include UFM for non-volatile storage, enabling configuration and data retention without external memory. |
| Maximum User I/O | 320 | 130 | Different I/O counts limit the number of peripherals and interfaces that can be connected, affecting system integration. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Matching core voltage ensures compatibility with the same power supply design and power management scheme. |
| Configuration Method | Instant-on (Internal Configuration) | Instant-on (Internal Configuration) | Both support instant-on configuration from internal flash, simplifying system boot and reducing external components. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16SAU169I7G | 10M16DCF484C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 320 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DCF484C8G and the 10M16SAU169I7G?
The 10M16DCF484C8G is a MAX 10 FPGA in a 484-pin FineLine BGA package with commercial temperature grade (0°C to 85°C junction) and speed grade 8. The 10M16SAU169I7G is a MAX 10 FPGA in a 169-pin UBGA package with industrial temperature grade (-40°C to 100°C junction) and speed grade 7. Both devices feature 16,000 logic elements, but they differ in package, temperature range, and speed grade.
Do the 10M16DCF484C8G and 10M16SAU169I7G have the same logic density?
Yes. Both devices are members of the Intel MAX 10 FPGA family and provide 16,000 logic elements (LEs), along with the same embedded memory and DSP block resources as defined by the MAX 10 10M16 device specification.
Can the 10M16DCF484C8G be used as a drop-in replacement for the 10M16SAU169I7G?
No. The two devices use different packages (484-pin FBGA vs. 169-pin UBGA), different temperature grades (commercial vs. industrial), and different speed grades (8 vs. 7). A drop-in replacement is not possible without a complete redesign of the PCB footprint, thermal management, and timing closure.
What are the operating temperature ranges for these two MAX 10 devices?
The 10M16DCF484C8G is rated for commercial temperature operation with a junction temperature range of 0°C to 85°C. The 10M16SAU169I7G is rated for industrial temperature operation with a junction temperature range of -40°C to 100°C.
Which device offers a faster speed grade, the 10M16DCF484C8G or the 10M16SAU169I7G?
The 10M16DCF484C8G has speed grade 8, while the 10M16SAU169I7G has speed grade 7. In Intel FPGA nomenclature, a lower speed grade number indicates faster performance. Therefore, the 10M16SAU169I7G (speed grade 7) is the faster of the two devices.
Are the I/O pin counts the same for the 10M16DCF484C8G and the 10M16SAU169I7G?
No. The 10M16DCF484C8G in the 484-pin FBGA package provides a higher number of user I/O pins than the 10M16SAU169I7G in the 169-pin UBGA package. The exact user I/O count for each device is specified in the Intel MAX 10 device pin-out files and datasheet.
Do both devices support the same configuration methods, such as internal configuration flash?
Yes. Both the 10M16DCF484C8G and the 10M16SAU169I7G are MAX 10 FPGAs featuring integrated dual-configuration flash memory, supporting instant-on configuration and both single and dual configuration images as defined by the MAX 10 family architecture.
Which device is more suitable for industrial applications with wide temperature swings?
The 10M16SAU169I7G is more suitable for industrial applications because it is rated for the industrial temperature range of -40°C to 100°C junction temperature. The 10M16DCF484C8G is limited to the commercial range of 0°C to 85°C junction temperature.