Part A
10M16DAU324C8G
訊息
- Lifecycle
- Active
- Stock
- 3130 件
- Package
- LFBGA-324
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16DAU324C8G and 10M16SCU324C8G are both Intel (Altera) MAX 10 FPGA devices sharing the same 16,000 logic element density, 324-ball UBGA package, and commercial temperature grade, making them strong functional replacement candidates. The primary distinction lies in their on-chip configuration memory architecture: the 10M16DAU324C8G integrates a dual-configuration flash feature, while the 10M16SCU324C8G provides single-configuration flash. Designers must verify configuration scheme requirements, board-level flash usage, and any associated power-up sequencing before substituting one for the other in a production design.
Logic Element Density
High match
Package Type
High match
Configuration Memory Architecture
Validation required
Operating Temperature Range
High match
Parts at a glance
Part B
10M16SCU324C8G
訊息
- Lifecycle
- Active
- Stock
- 1405 件
- Package
- LFBGA-324
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAU324C8G | 10M16SCU324C8G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 16,000 | 16,000 | Identical logic density ensures the same amount of programmable logic resources is available for the design. |
| Package | 324-pin UBGA | 324-pin UBGA | Same package and pin count allow a drop-in replacement on the same PCB footprint. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Matching temperature grades confirm both parts are suitable for the same thermal environment. |
| Speed Grade | 8 | 8 | Same speed grade means equivalent timing performance and maximum operating frequency. |
| Embedded Memory | Up to 588 Kbits | Up to 588 Kbits | Identical on-chip memory capacity supports the same data buffering and storage requirements. |
| Configuration Flash (Internal) | Yes (dual configuration) | Yes (single configuration) | The DA variant supports dual configuration images while the SC variant supports single configuration, affecting instant-on and fail-safe reconfiguration capability. |
| Analog-to-Digital Converter (ADC) | Yes | No | The DA variant integrates an on-chip ADC for analog monitoring, while the SC variant lacks this feature, limiting use in analog-sensing applications. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Same core voltage simplifies power supply design and ensures electrical compatibility. |
| User I/O Count | 246 | 246 | Identical I/O count ensures the same number of external interfaces can be supported. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAU324C8G | 10M16SCU324C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 246 | 246 |
| Voltage - Supply | 1.15V ~ 1.25V | 2.85V ~ 3.465V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 10M16DAU324C8G and 10M16SCU324C8G devices?
Both are Intel (formerly Altera) MAX 10 family field-programmable gate arrays (FPGAs) in the 324-pin Ultra FineLine BGA (UBGA) package, with a 16,000-logic-element (16K LE) density and a C8 speed grade. The 10M16DAU324C8G is a dual-supply (DA) variant, while the 10M16SCU324C8G is a single-supply (SC) variant.
What is the primary difference between the 10M16DAU324C8G and the 10M16SCU324C8G?
The main difference is the power supply configuration. The 10M16DAU324C8G (DA suffix) requires both a 1.2 V core supply (VCC) and a 2.5 V or 3.3 V auxiliary supply (VCCA). The 10M16SCU324C8G (SC suffix) uses a single 3.3 V supply for both core and auxiliary rails, simplifying power design.
Are the 10M16DAU324C8G and 10M16SCU324C8G pin-compatible?
Yes. Both devices share the same 324-pin UBGA package and the same pinout for the MAX 10 16K LE density in that package. However, power pin assignments differ because of the different supply schemes, so the power rail connections must be adjusted accordingly.
Do the 10M16DAU324C8G and 10M16SCU324C8G have the same logic density and speed grade?
Yes. Both are 16,000 LE MAX 10 FPGAs with a C8 speed grade, so their fabric capacity and timing performance are equivalent when operated within the specified conditions for each supply variant.
Can the 10M16DAU324C8G and 10M16SCU324C8G be used interchangeably in an existing design?
Not without design changes. Because the DA variant requires a 1.2 V core rail plus an auxiliary rail, while the SC variant operates from a single 3.3 V rail, the power delivery network, decoupling, and possibly the configuration scheme must be revalidated before substitution.
What configuration options are available on the 10M16DAU324C8G and 10M16SCU324C8G?
Both devices support MAX 10 configuration features such as internal configuration flash, instant-on operation, and dual configuration images. They also support external configuration via JTAG and can implement user flash memory (UFM) for non-volatile storage.
Which device is better for a single-supply 3.3 V board design?
The 10M16SCU324C8G is the appropriate choice for a single 3.3 V supply design, as it eliminates the need for a separate 1.2 V core regulator. The 10M16DAU324C8G is intended for designs that provide a 1.2 V core rail and a separate auxiliary supply.
Do both devices support the same embedded features such as ADC and DSP blocks?
Yes. Both the 10M16DAU324C8G and 10M16SCU324C8G are MAX 10 16K LE devices and include the same embedded hard IP for that density, including analog-to-digital converter (ADC) blocks and digital signal processing (DSP) blocks, subject to the same device family documentation.