Part A
10CL080YF780I7G
阿爾特拉
- Lifecycle
- Active
- Stock
- 4082 件
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10CL080YF780I7G and 10CL055YF484C8G are both Intel Cyclone 10 LP FPGAs sharing the same core architecture and 1.2 V core supply, but they differ in logic density, package footprint, and temperature grade. The 10CL080YF780I7G offers higher logic capacity and a larger I/O count in a 780-pin FBGA package with industrial temperature rating, while the 10CL055YF484C8G provides lower density in a compact 484-pin FBGA package with commercial temperature rating. They are not pin-compatible drop-in replacements, and substitution requires validation of logic utilization, I/O assignment, board layout, and thermal environment.
Logic Density
Validation required
Package Type
Not compatible
I/O Count
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
10CL055YF484C8G
訊息
- Lifecycle
- Active
- Stock
- 4745 件
- Package
- FBGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10CL080YF780I7G | 10CL055YF484C8G | Why it matters |
|---|---|---|---|
| Logic Elements (LEs) | 80,000 | 55,000 | Logic capacity determines how much custom digital logic can be implemented; a device with fewer LEs cannot host a design that requires more logic resources. |
| Package | 780-pin FBGA (FineLine BGA) | 484-pin FBGA (FineLine BGA) | Package footprint and ball count must match the PCB layout; different packages are not drop-in compatible and require a board redesign. |
| Maximum User I/O Pins | 429 | 321 | Available I/O count limits how many external signals the device can interface with; insufficient I/O prevents connecting all required peripherals. |
| Total Embedded Memory (M9K blocks) | 305 M9K blocks (approx. 2,746 Kbit) | 260 M9K blocks (approx. 2,340 Kbit) | On-chip memory capacity affects buffering, FIFO depth, and data storage within the FPGA; designs needing more memory than available cannot be implemented. |
| Embedded Multiplier (18x18) Blocks | 244 | 156 | Dedicated multiplier blocks determine DSP throughput; fewer multipliers reduce the ability to implement parallel arithmetic operations. |
| Speed Grade | 7 (fastest) | 8 (slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet timing requirements of a given design. |
| Operating Temperature Range | Industrial (-40°C to +100°C junction) | Commercial (0°C to +85°C junction) | Temperature grade determines the environment in which the device can reliably operate; industrial and commercial parts are not interchangeable in extreme conditions. |
| Core Supply Voltage (VCCINT) | 1.2 V | 1.2 V | Core voltage must match the board power design; identical values indicate power supply compatibility for this rail. |
| Family / Series | Cyclone 10 LP | Cyclone 10 LP | Same family ensures similar architecture, tool support, and IP compatibility, which is essential for design portability. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10CL080YF780I7G | 10CL055YF484C8G |
|---|---|---|
| Series | Cyclone® 10 LP | Cyclone® 10 LP |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 3491 |
| Number of Logic Elements/Cells | - | 55856 |
| Total RAM Bits | 2810880 | 2396160 |
| Number of I/O | 423 | 321 |
| Voltage - Supply | 1.2V | 1.2V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 5079 | - |
| Number of Logic Elements / Cells | 81264 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the 10CL080YF780I7G and the 10CL055YF484C8G?
The 10CL080YF780I7G is a Cyclone 10 LP FPGA with 80,000 logic elements in a 780-pin FBGA package, while the 10CL055YF484C8G has 55,000 logic elements in a 484-pin FBGA package. They differ in logic density, package size, pin count, and speed grade (I7 vs C8).
Are the 10CL080YF780I7G and 10CL055YF484C8G pin-to-pin compatible?
No. The 10CL080YF780I7G uses a 780-pin FBGA package, whereas the 10CL055YF484C8G uses a 484-pin FBGA package. The different pin counts and package footprints prevent direct pin-to-pin compatibility.
Can the 10CL055YF484C8G be used as a direct drop-in replacement for the 10CL080YF780I7G?
No. The two devices differ in logic element count (55K vs 80K), package (484-pin vs 780-pin FBGA), and speed grade (C8 vs I7). A direct drop-in replacement is not possible without redesigning the PCB and verifying timing, I/O, and power requirements.
What are the operating temperature ranges for these two devices?
The 10CL080YF780I7G has an industrial temperature grade (I7), typically supporting -40°C to 100°C junction temperature. The 10CL055YF484C8G has a commercial temperature grade (C8), typically supporting 0°C to 85°C junction temperature. Refer to the official Intel Cyclone 10 LP datasheet for exact thermal specifications.
Do both devices belong to the same FPGA family?
Yes. Both the 10CL080YF780I7G and the 10CL055YF484C8G are members of the Intel Cyclone 10 LP FPGA family, sharing the same architecture and supported development tools.
Which device offers higher logic density and when should it be selected?
The 10CL080YF780I7G offers higher logic density with 80,000 logic elements compared to 55,000 logic elements in the 10CL055YF484C8G. The 10CL080YF780I7G should be selected when the design requires more logic resources, additional I/O pins, or industrial temperature operation.
Are the configuration and power supply requirements the same for both devices?
Both devices are Cyclone 10 LP FPGAs and share similar configuration schemes and core voltage requirements as defined in the Intel Cyclone 10 LP device datasheet. However, exact power supply rail requirements, decoupling, and configuration pin assignments must be verified per package and device density in the official datasheet.