10CL016YU484C8G vs 10CL080YF484C6G

對 10CL016YU484C8G 和 10CL080YF484C6G 的深入比較，為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素，包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異，簡化了元件選擇，讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10CL080YF484C6G is a viable functional replacement candidate for the 10CL016YU484C8G in applications where higher logic density and a faster speed grade are acceptable, provided that power budgeting and thermal management are validated for the target design.

Logic Density Validation required
Package Type High match
Speed Grade Validation required
Supply Voltage High match

Review the critical differences →

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10CL016YU484C8G 10CL080YF484C6G Why it matters
Logic Elements (LEs) 16,000 80,000 Logic capacity determines how complex a design the device can implement; a 5x difference means the two parts are not functionally interchangeable for larger designs.
Total Embedded Memory 504 Kbit 2,810 Kbit On-chip memory limits buffering, FIFO depth, and data storage; the larger device supports substantially more memory-intensive applications.
Embedded 18x18 Multipliers 56 244 Multiplier count governs DSP throughput; designs relying on many parallel MAC operations may not fit in the smaller device.
Maximum User I/O Pins 340 340 I/O count determines how many external signals can be interfaced; matching counts helps with pinout compatibility.
PLLs 4 4 PLLs provide clock synthesis and management; equal counts support similar clocking architectures.
Speed Grade 8 (Slowest) 6 (Faster) Speed grade affects maximum operating frequency and timing closure; a faster grade can meet tighter timing but may increase power.
Package 484-pin UBGA (23x23 mm) 484-pin FBGA (23x23 mm) Package type and footprint affect PCB layout and assembly; different ball maps may prevent drop-in replacement.
Operating Temperature Range 0°C to +85°C (Commercial) 0°C to +85°C (Commercial) Temperature range defines the environment in which the device can reliably operate; matching ranges support similar application conditions.
Core Supply Voltage 1.2 V 1.2 V Core voltage must match the board power design; identical values simplify power supply reuse.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10CL016YU484C8G 10CL080YF484C6G
Supplier - Intel
Series Cyclone® 10 LP Cyclone® 10 LP
Part Status Active Active
Number of LABs/CLBs 963 5079
Number of Logic Elements/Cells 15408 81264
Total RAM Bits 516096 2810880
Number of I/O 340 289
Voltage - Supply 1.2V 1.2V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 10CL016YU484C8G and the 10CL080YF484C6G?

The 10CL016YU484C8G is an Intel Cyclone 10 LP FPGA with 16,000 logic elements in a 484-pin UBGA package, while the 10CL080YF484C6G is a Cyclone 10 LP FPGA with 80,000 logic elements in a 484-pin FBGA package. The 10CL080YF484C6G offers significantly higher logic density and a faster speed grade (C6 vs. C8), but both share the same 484-ball package footprint family.

Are the 10CL016YU484C8G and 10CL080YF484C6G pin-compatible?

No. Although both devices use a 484-ball package, the 10CL016YU484C8G uses a UBGA (Ultra FineLine BGA) package while the 10CL080YF484C6G uses an FBGA (FineLine BGA) package. These are distinct package types with different ball pitches and land patterns, so they are not drop-in pin-compatible replacements.

Can the 10CL016YU484C8G be substituted with the 10CL080YF484C6G in an existing design?

Not directly. The two devices differ in logic capacity (16K vs. 80K logic elements), package type (UBGA vs. FBGA), and speed grade (C8 vs. C6). A substitution would require a complete design recompile, pinout reassignment, PCB layout revision, and timing revalidation against the target device datasheet.

What is the logic element count for each device?

The 10CL016YU484C8G contains 16,000 logic elements, while the 10CL080YF484C6G contains 80,000 logic elements. Both are members of the Intel Cyclone 10 LP FPGA family.

What speed grades do the 10CL016YU484C8G and 10CL080YF484C6G use?

The 10CL016YU484C8G is specified with a C8 speed grade, and the 10CL080YF484C6G is specified with a C6 speed grade. The C6 grade indicates faster performance than the C8 grade within the Cyclone 10 LP family.

Do both devices belong to the same FPGA family?

Yes. Both the 10CL016YU484C8G and the 10CL080YF484C6G are Intel Cyclone 10 LP FPGAs, sharing the same architecture, configuration scheme, and IP support, though they differ in density, package, and speed grade.

Which device is better suited for higher-logic-density applications?

The 10CL080YF484C6G is better suited for higher-logic-density applications because it provides 80,000 logic elements compared to 16,000 logic elements in the 10CL016YU484C8G. The higher density supports more complex digital designs, wider datapaths, and larger peripheral integration.

Are the operating voltage and configuration requirements the same for both devices?

Both devices are Cyclone 10 LP FPGAs and share the same family-level core and I/O voltage requirements as specified in the Intel Cyclone 10 LP device datasheet. However, exact I/O bank voltages, configuration schemes, and power sequencing must be verified per device against the official datasheet before design implementation.

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