10AX048H3F34E2SG
訊息
- Lifecycle
- Active
- Stock
- 6684 件
- Package
- FBGA-1152
- Series
- 嵌入式FPGA(現場可程式設計閘陣列)
對 10AX048H3F34E2SG 和 10AX032E2F29E2SG 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 10AX048H3F34E2SG and 10AX032E2F29E2SG are both Intel Arria 10 GX FPGAs sharing the same transceiver architecture, logic cell family, and 20 nm process node, making them functionally related candidates. However, they differ in logic density, package footprint, and speed grade, so the 10AX032E2F29E2SG cannot serve as a drop-in replacement for the 10AX048H3F34E2SG without design and PCB revisions. Validation of resource utilization, pinout, and thermal performance is required before substitution.
訊息
訊息
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048H3F34E2SG | 10AX032E2F29E2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 320,000 | Logic capacity determines the maximum complexity of designs the FPGA can implement; a lower LE count may not fit the original design. |
| Total RAM (Mb) | 28.4 | 19.0 | On-chip memory affects buffering, FIFO depth, and data storage capability; insufficient RAM can force external memory or redesign. |
| DSP Blocks (18x19 MAC) | 1,368 | 912 | DSP blocks are essential for arithmetic-intensive functions like filtering and FFT; fewer blocks may limit signal processing throughput. |
| Package | FBGA-1152 (F34) | FBGA-780 (F29) | Package footprint and ball count must match the PCB layout; a different package is not drop-in compatible. |
| Transceiver Count | 36 | 24 | High-speed serial transceivers determine the number of supported interfaces such as PCIe, Ethernet, and backplane links. |
| Maximum Transceiver Data Rate | 17.4 Gbps | 17.4 Gbps | Data rate per transceiver defines the bandwidth available for each high-speed serial link. |
| Speed Grade | 3 (High Performance) | 2 (Standard Performance) | Speed grade affects timing closure, maximum clock frequency, and power; a slower grade may not meet original timing requirements. |
| Operating Temperature Range | 0°C to 100°C (Commercial) | 0°C to 100°C (Commercial) | Temperature range must match the application environment for reliable operation. |
| I/O Pins (Maximum) | 624 | 480 | Available I/O pins determine how many external peripherals and interfaces can be connected. |
| Core Voltage | 0.9 V | 0.9 V | Core voltage must match the board power supply design; a mismatch requires power rail redesign. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10AX048H3F34E2SG | 10AX032E2F29E2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | 183590 | 119900 |
| Number of Logic Elements/Cells | 480000 | 320000 |
| Total RAM Bits | 5664768 | 21040128 |
| Number of I/O | 492 | 360 |
| Voltage - Supply | 0.87V ~ 0.93V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
The 10AX048H3F34E2SG is an Arria 10 GX FPGA with 480,000 logic elements in a 1152-pin FBGA package, while the 10AX032E2F29E2SG is an Arria 10 GX FPGA with 320,000 logic elements in a 780-pin FBGA package. They differ in logic density, package size, pin count, and transceiver count.
No. The 10AX048H3F34E2SG uses a 1152-pin FBGA package (F34) while the 10AX032E2F29E2SG uses a 780-pin FBGA package (F29). The different package sizes and pin counts make them physically and electrically incompatible for direct PCB replacement.
Yes. Both the 10AX048H3F34E2SG and 10AX032E2F29E2SG are members of the Intel Arria 10 GX FPGA family, sharing the same architecture, transceiver technology, and hardened IP blocks, but with different logic densities and package options.
The 10AX048H3F34E2SG contains 480,000 logic elements, while the 10AX032E2F29E2SG contains 320,000 logic elements. This difference affects available resources for user logic, DSP blocks, and memory implementation.
No. The two devices have different logic densities, package footprints, pin counts, and transceiver configurations. A drop-in replacement is not possible without redesigning the PCB and revalidating the design against the lower logic capacity of the 10AX032E2F29E2SG.
Both devices are Arria 10 GX FPGAs featuring integrated transceivers supporting data rates up to 17.4 Gbps for chip-to-chip and backplane applications. The exact number of transceiver channels differs between the 1152-pin and 780-pin package variants.
The 10AX048H3F34E2SG is better suited for higher logic density applications because it provides 480,000 logic elements compared to 320,000 logic elements in the 10AX032E2F29E2SG. The larger device also offers more I/O pins due to its larger package.
Both are Arria 10 GX FPGAs and share the same family-level configuration schemes and core voltage requirements. However, exact power rail requirements, decoupling, and configuration pin assignments must be verified against the respective device pin-out files and datasheets due to package differences.