Part A
10AX048H2F34E2SG
阿爾特拉
- Lifecycle
- Active
- Stock
- 4660 件
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10AX048H2F34E2SG and 10AX032E3F27E2SG are both Intel Arria 10 GX FPGA devices sharing the same transceiver architecture, package family, and temperature grade, making the 10AX032E3F27E2SG a viable functional replacement candidate for the 10AX048H2F34E2SG in lower-logic-density applications. However, the significant difference in logic capacity and the different speed grade require careful validation against the target design's resource and timing requirements before substitution.
Logic Density
Validation required
Speed Grade
Validation required
Package Type
High match
Transceiver Count
High match
Parts at a glance
Part B
10AX032E3F27E2SG
訊息
- Lifecycle
- Active
- Stock
- 8685 件
- Package
- BBGA-672
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048H2F34E2SG | 10AX032E3F27E2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 320,000 | Logic capacity determines the maximum complexity of digital designs the device can implement; a lower LE count may not fit a design built for the larger device. |
| Adaptive Logic Modules (ALM) | 183,590 | 122,400 | ALMs are the fundamental logic building blocks; fewer ALMs directly limits the amount of combinational and sequential logic available. |
| Total Embedded Memory | 28,080 Kbit | 18,720 Kbit | On-chip memory affects buffering, FIFO depth, and data storage capability; insufficient memory can prevent a design from fitting or meeting performance targets. |
| Variable-Precision DSP Blocks | 1,368 | 912 | DSP blocks accelerate multiply-accumulate operations; fewer blocks reduce throughput for signal processing and arithmetic-intensive applications. |
| Maximum User I/O Pins | 492 | 336 | I/O count determines how many external interfaces and peripherals can be connected; a lower pin count may be insufficient for the target board design. |
| Package | FBGA-1152 | FBGA-672 | Package footprint and ball count must match the PCB layout; different packages are not drop-in compatible and require a board redesign. |
| Speed Grade | 2 (High Performance) | 3 (Standard Performance) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the original design's timing requirements. |
| Transceiver Count | 36 | 24 | High-speed serial transceivers enable protocols such as PCIe, Ethernet, and JESD204; fewer transceivers limit high-speed interface connectivity. |
| Transceiver Data Rate | Up to 17.4 Gbps | Up to 17.4 Gbps | Maximum transceiver line rate determines which high-speed serial protocols can be supported without overclocking or gearboxing. |
| Operating Temperature Range | 0°C to 100°C (TJ) | 0°C to 100°C (TJ) | Junction temperature range must cover the application's thermal environment; exceeding it risks reliability and functional failure. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX048H2F34E2SG | 10AX032E3F27E2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 119900 |
| Number of Logic Elements/Cells | - | 320000 |
| Total RAM Bits | 5664768 | 21040128 |
| Number of I/O | 492 | 240 |
| Voltage - Supply | 0.87V ~ 0.98V | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 183590 | - |
| Number of Logic Elements / Cells | 480000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the Intel 10AX048H2F34E2SG and the 10AX032E3F27E2SG FPGA devices?
The 10AX048H2F34E2SG is an Intel Arria 10 GX FPGA with 480,000 logic elements, a 1150-pin FBGA package (34 mm x 34 mm), and a speed grade of 2. The 10AX032E3F27E2SG is an Arria 10 GX FPGA with 320,000 logic elements, a 672-pin FBGA package (27 mm x 27 mm), and a speed grade of 3. The primary differences are logic density, package size and pin count, and speed grade.
Are the 10AX048H2F34E2SG and 10AX032E3F27E2SG pin-to-pin compatible?
No. The 10AX048H2F34E2SG uses a 1150-pin FBGA package, while the 10AX032E3F27E2SG uses a 672-pin FBGA package. The different pin counts and package dimensions mean they are not pin-to-pin compatible and require different PCB footprints.
Can the 10AX032E3F27E2SG be used as a direct drop-in replacement for the 10AX048H2F34E2SG?
No. A direct drop-in replacement is not possible because the two devices differ in package pin count, package size, logic density, and speed grade. Any substitution requires a complete design review, including PCB layout changes, power delivery verification, and timing closure analysis against the target device datasheet.
What are the logic element counts for the 10AX048H2F34E2SG and 10AX032E3F27E2SG?
The 10AX048H2F34E2SG contains 480,000 logic elements. The 10AX032E3F27E2SG contains 320,000 logic elements. These values are specified in the Intel Arria 10 device family datasheet and determine the available programmable logic capacity for each device.
What speed grades are associated with the 10AX048H2F34E2SG and 10AX032E3F27E2SG?
The 10AX048H2F34E2SG is specified with speed grade 2. The 10AX032E3F27E2SG is specified with speed grade 3. Speed grade affects achievable core and transceiver performance and must be considered during timing analysis and design migration.
Do both devices belong to the same Intel FPGA family and transceiver class?
Yes. Both the 10AX048H2F34E2SG and the 10AX032E3F27E2SG are Intel Arria 10 GX family FPGAs. The "GX" designation indicates they include high-speed transceivers, but the exact transceiver count and supported data rates depend on the specific package and device variant as documented in the Intel Arria 10 datasheet.
What package types and dimensions are used by the 10AX048H2F34E2SG and 10AX032E3F27E2SG?
The 10AX048H2F34E2SG uses a 1150-pin FBGA package measuring 34 mm x 34 mm. The 10AX032E3F27E2SG uses a 672-pin FBGA package measuring 27 mm x 27 mm. These package differences affect PCB routing density, thermal performance, and available I/O count.
What should be verified before migrating a design from the 10AX032E3F27E2SG to the 10AX048H2F34E2SG?
Before migration, verify pinout and package footprint compatibility, power supply requirements and rail sequencing, transceiver channel availability and placement, PLL and clocking resources, configuration scheme compatibility, and timing closure at the target speed grade. All parameters must be confirmed against the official Intel Arria 10 device datasheet and pin-out files.