Part A
10AX048E4F29E3SG
訊息
- Lifecycle
- Active
- Stock
- 4866 件
- Package
- FBGA-780
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10AX048E4F29E3SG and 10AX032E2F29I2SG are both Intel Arria 10 GX FPGAs in the same FBGA-780 package, sharing identical I/O and transceiver resources, which makes them functionally interchangeable at the board level. However, they differ in logic density, speed grade, and operating temperature range, so the 10AX032E2F29I2SG can only serve as a lower-capacity, industrial-temperature substitute when the design's logic utilization and timing margins permit.
Logic Density
Validation required
Speed Grade
Validation required
Package Type
High match
Operating Temperature
Validation required
Parts at a glance
Part B
10AX032E2F29I2SG
訊息
- Lifecycle
- Active
- Stock
- 9496 件
- Package
- BBGA-780
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048E4F29E3SG | 10AX032E2F29I2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 320,000 | Logic capacity determines how much custom digital logic can be implemented; a smaller device may not fit the original design. |
| Total RAM Bits | 34,570,240 | 17,203,200 | On-chip memory affects buffering, FIFO depth, and data storage capability; insufficient RAM can break functionality. |
| DSP Blocks | 1,368 | 1,000 | DSP blocks are needed for arithmetic-intensive functions such as filtering and FFT; fewer blocks may limit signal processing performance. |
| Speed Grade | 4 | 2 | Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet original timing requirements. |
| Operating Temperature Range | 0°C to 100°C (Extended) | -40°C to 100°C (Industrial) | Temperature range must match the application environment; industrial grade is required for harsh or outdoor conditions. |
| Package | FBGA-780 | FBGA-780 | Package must match for physical board compatibility and pinout alignment. |
| Family | Arria 10 GX | Arria 10 GX | Same device family ensures compatible architecture, toolchain support, and IP reuse. |
| Transceiver Count | 24 | 12 | Transceivers support high-speed serial interfaces; fewer channels may prevent connecting all required links. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX048E4F29E3SG | 10AX032E2F29I2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | 183590 | 119900 |
| Number of Logic Elements/Cells | 480000 | 320000 |
| Total RAM Bits | 5664768 | 21040128 |
| Number of I/O | 360 | 360 |
| Voltage - Supply | 0.87V ~ 0.98V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10AX048E4F29E3SG and 10AX032E2F29I2SG Intel Arria 10 FPGAs?
The 10AX048E4F29E3SG features 480,000 logic elements, a speed grade of 4, and an extended temperature range of 0°C to 100°C junction temperature. The 10AX032E2F29I2SG features 320,000 logic elements, a faster speed grade of 2, and an industrial temperature range of -40°C to 100°C junction temperature. Both use the same 780-pin FBGA package with a 29 mm x 29 mm body size.
Are the 10AX048E4F29E3SG and 10AX032E2F29I2SG pin-compatible?
Yes, both devices are offered in the same F29 package, which is a 780-pin FineLine BGA (FBGA) with a 29 mm x 29 mm body. However, pin assignments and I/O bank usage may differ based on the specific device density and configuration. Designers must verify pinout compatibility using the respective device pinout files from Intel (Altera) documentation before considering a board-level swap.
Can the 10AX032E2F29I2SG be used as a direct drop-in replacement for the 10AX048E4F29E3SG?
No, a direct drop-in replacement is not possible without design validation. The 10AX048E4F29E3SG has a larger logic capacity (480K LE vs. 320K LE), a different speed grade (4 vs. 2), and a different temperature grade (extended vs. industrial). The 10AX032E2F29I2SG has a faster speed grade and wider industrial temperature range, but fewer logic resources. The target design must be recompiled and timing-closed for the replacement device, and power delivery, configuration, and I/O assignments must be verified against the new device's requirements.
What is the operating temperature range for each device?
The 10AX048E4F29E3SG is rated for an extended temperature range with a junction temperature (Tj) of 0°C to 100°C. The 10AX032E2F29I2SG is rated for an industrial temperature range with a junction temperature (Tj) of -40°C to 100°C. The industrial-grade device is suitable for applications requiring operation below 0°C ambient or junction temperatures.
What are the speed grade and performance implications of the 10AX048E4F29E3SG versus the 10AX032E2F29I2SG?
The 10AX048E4F29E3SG has a speed grade of 4, while the 10AX032E2F29I2SG has a speed grade of 2. In Intel Arria 10 nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10AX032E2F29I2SG offers higher maximum operating frequencies and faster timing closure for critical paths compared to the 10AX048E4F29E3SG. However, the 10AX048E4F29E3SG provides more logic elements (480K vs. 320K) for larger designs.
Do both devices support the same configuration and transceiver options?
Both devices are members of the Intel Arria 10 GX family and support similar configuration schemes, including active serial (AS), passive serial (PS), and JTAG. However, the number of available high-speed transceivers, I/O pins, and hard IP blocks (such as PCIe hard IP and memory controllers) may differ between the 480K LE and 320K LE densities. Designers must consult the Intel Arria 10 Device Handbook and the respective device pinout files to confirm transceiver count, data rates, and hard IP availability for each specific ordering code.
What are the power supply requirements for these two FPGAs?
Both devices require the standard Intel Arria 10 power rails, including VCC, VCCP, VCCAUX, VCCIO, and VCCA for transceivers. The exact current requirements and decoupling recommendations depend on the device density, speed grade, and resource utilization. The 10AX048E4F29E3SG, with higher logic density, may draw more static and dynamic power than the 10AX032E2F29I2SG under similar operating conditions. Intel's Early Power Estimator (EPE) or PowerPlay Power Analyzer must be used to determine specific power budgets for each device in the target design.
Which device is more suitable for industrial applications with wide temperature variations?
The 10AX032E2F29I2SG is more suitable for industrial applications requiring operation below 0°C, as it is rated for an industrial temperature range of -40°C to 100°C junction temperature. The 10AX048E4F29E3SG is rated for 0°C to 100°C junction temperature and is intended for extended-temperature commercial applications. If the application requires reliable operation in sub-zero environments, the industrial-grade 10AX032E2F29I2SG is the appropriate choice, provided its 320K logic element capacity and speed grade 2 meet the design's performance and resource requirements.